EcoDesign '99:

1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing

1st CALL FOR PAPERS

EcoDesign’99 Registration Form

Eco Design’99 Abstract Submission Reply Form

Conference Overview

The EcoDesign'99 organizing committee is pleased to announce EcoDesign'99, the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, to be held on February 1-3, 1999 in Tokyo, Japan. The ever-growing demand for environmental consciousness has necessitated the establishment of closed-loop life cycles for products. This has led to the new manufacturing concept of inverse manufacturing(IM) which integrates indispensable elements for developing closed-loop product life cycles (especially product remanufacturing and component reuse), such as life cycle design (product design and process design), maintenance methodologies, advanced reuse and recycling technologies, enterprise strategies, and public policies.

EcoDesign'99 will provide a forum for presentation and discussion of these topics as they pertain to engineers, managers, and others engaged in the research, development, and manufacturing of electric, electronic, and mechatronic products. The emphasis of this symposium will be on new approaches in research and on practical case studies from the industry having technical, strategic, or economic ramifications.

Topics

Category A: Design and Life Cycle Management

A-1) Environmentally Conscious Product Design

(Methodologies, Tools, Information Technologies, and others)

A-2) Design for X

(Reusability, Maintainability, Longer Life / Reliability, Recyclability, Disassembly, Energy-saving, and others)

A-3) Design for Closed-loop Product Life Cycle

(Methodologies, Tools, Information Technologies, and others)

A-4)  Life Cycle Management

(Methodologies, Tools, Information Technologies, and others)

Category B: Social Systems, Business, and Practices

B-1) Social System Design

B-2) Practices and Examples of Environmental Business

B-3) Education for Environmental Consciousness

B-4) Environmental Management Systems (Environmental Auditing and Full Cost Accounting)

B-5) Environmental Labeling and Green Purchasing

Category C: Process Technologies and Elemental Technologies

C-1) Eco-Material

C-2) Maintenance and Service Engineering

C-3) Reuse and Recycling (Strategies and Technologies)

C-4) Waste Disposal and Sorting Technologies

C-5) Cleaner Processes and Energy-saving Technologies

C-6) Technologies for Lead-Free Electronics Packaging

Official Language

English

Submission of Abstracts

Please submit three copies of a one-page (A4 or Letter size) abstract to EcoDesign'99 Contact Point by June 30, 1998. together with the attached form.
Acceptance of papers will be notified in late July.  Camera-ready manuscripts are due by November 20, 1998. Papers must be 2-6 pages (A4, 210 mm × 297 mm) in length, including all figures, tables, and references.
The conference proceedings will be published by the IEEE.

Important Dates

Program (Summary)

Details will be presented in the Advanced Program.

February 1

Morning; Tutorials

Afternoon; Opening and Plenary Sessions

February 2

Keynote Speeches and Technical Sessions

February 3

Keynote Speeches and Technical Sessions

Events

Details will be presented in the Advanced Program.

Hotel Reservation and others

Programs and accommodation information will be mailed with the Advanced Program in September, 1998.

Registration Fees

Early registration is recommended. Please fill in the Registration Form and mail it to the Secretariat Contact Point with the payment fee.

Conference registration fees include conference attendance, a copy of the proceedings, a welcome party and a banquet fee. The student registration fee does not include the banquet fee. The tutorial fee is optional.

Payment:

Please choose one from the followings:

Bank Name: Daiichi Kangyo Bank, Hongo Branch, Tokyo

Account No: 2047669 Ordinary

Account Name: EcoDesign ’99

*Please attach (fax) the copy of the bank transfer receipt.

American Express, VISA, Master(UC), Diners

** No personal check is available.

***Do not remit the fee before sending the registration form.

Cancellation:

Cancellation with refund will be accepted before December 31, 1998. There is a cancellation fee of ¥5,000-. Written notification should be required.

Plenary and Keynote Speakers (tentative)

B. R. Allenby (ATT, USA)

D. Bendz (IBM, USA)

H. Brezet (Technical Univ. of Delft, Netherlands)

C. Handwerker (NIST, USA)

K. Ishii (Stanford Univ., USA)

J. Lee (UTRC, USA): Strategies for Product Life-Cycle Support in an Information Age

A. Stevels (Philips, Netherlands: Integration of EcoDesign into Business, a New Challenge

N. Goto (NIES, Japan)

K. Harada (NRIM, Japan)

R. Yamamoto (Univ. of Tokyo): Improvement of Eco-efficiency through EcoDesign

M. Akai (Mechanical Engineering Laboratory Agency)

T. Kiuchi (Mitsubishi Electric Co.)

T. Nitta (Matsushita Electric Industrial Co., Ltd.)

K. Yamaji (Nihon Tetra Pak K.K.)

 

Presentation Titles (submitted before May 15)

Category A

Life Cycle Product Modeling

(F. Kimura: Univ. of Tokyo, Japan)

Proposal of Upgradable Design

(Y. Umeda: Univ. of Tokyo, Japan)

Extension of the Product Life Time of Consumer Electronic Products

(N. van Nes: TU Delft, Netherlands)

Life Cycle Simulation for IM

(A. Nonomura: Univ. of Tokyo, Japan)

Danish Experience with the EDIP Tool for Environmental Design of Industrial Products

(H. Wenzel: TU Denmark, Denmark)

Environmentally Conscious Design Support: Software and Case Studies

(D. Hunkeler: EPFL, Switzerland)

CAD for Environmentally Conscious Products

(T. Ishida: Hitachi, Japan)

Life Cycle Design Support Based on Environmental Information Sharing

(T. Kiriyama: Univ. of Tokyo, Japan)

Prototype Development for Environmental Information System for Products - Manufacturer Supporting Subsystem -

(S. Miyamoto: NEC, Japan)

Prototype Development for Environmental Information System for Products - Database Technologies -

(T. Ohhashi: Hitachi, Japan)

A New Design Concept in Environmentally Friendly IT Appliance

(T. Tamura: NEC, Japan)

Environmentally Conscious Office Equipment

(A. Inoue: Fuji Xerox, Japan)

Eco Design of Pumps in Manufacturing and Their Use

(H. Okazaki: Ebara, Japan)

On Optimal Design for Hybrid Engine Systems for Automobiles

(P. Papalambros: Univ. of Michigan, USA)

Eco-Composite Design Method

(N. Kikuchi: Univ. of Michigan, USA)

Product Design Adaptable to Changes of Life Cycles

(F. Masuda: Open House, Japan)

 

Category B

Post Mass Production Paradigm

(T. Tomiyama: Univ. of Tokyo, Japan)

State of Industrial Evolution

(Y. Baba: Univ. of Tokyo, Japan)

IM from the Viewpoint of Disposal Treatment and Collection Systems

(N. Tanaka: Hokkaido Univ., Japan)

Evaluation of Environmental Loads and Information Release

(S. Ikeda: Tsukuba Univ., Japan)

Consensus Formation for IM

(T. Nakanishi: Univ. of Tokyo, Japan)

Inverse Manufacturing in the Case of FUJIFILM 'Quick Snap'

(A. Fukano: Fuji Film, Japan)

Product Stewardship: Providing Customer Focused Solutions for Environmental Responsibility

(J. Heusinkveld: HP, USA)

Consumer Computer Recovery and Recycling: The San Jose, California Collection Projec

(T. Bartel: UNISYS, USA)

 

Category C

Disassemblability Assessment for IM

(T. Suga: Univ. of Tokyo, Japan)

Active Disassembly

(D. Kasa: Univ. of Tokyo, Japan)

Selective Disassembly

(F. Kitaoka: Univ. of Tokyo, Japan)

Reversible Interconnection

(N. Hosoda: Univ. of Tokyo, Japan)

Eco-Design for Active Disassembly using Shape Memory Polymers

(J. D. Chiodo: Brunel Univ., UK)

Maintenance Engineering in the Public Service Sector

(Y. Umeda: Univ. of Tokyo, Japan)

Remote Maintenance for IM

(I. Goncharenko: Univ. of Tokyo, Japan)

Renewable Resources: Vision for the Future

(P. Nahar: Indian Inst. of Tech., India)

Cleaner Production: a Guide to Information Sources

(C. Spirinckx: Flemish Inst. for Tech. Res., Belgium)

Automation of Disassembly Processes and its Information Systems

(B. David: Ecole Centrale de Lyon, France)

Disassemble Factories for the Recovery of Resources in Product and Material Cycles

(H. Perlewize: TU Berlin, Germany)

Assembling and Disassembling for Modularized Microchips

(K. Saitou: Univ. of Michigan, USA)

Recycling Technologies in Hitachi

(M. Uno: Hitachi, Japan)

Application of Physical Separation Technologies to the Shredder Fluffs

(S. Owada: Waseda Univ., Japan)

Sewage Reuse Technologies

(T. Isogai: Meidensha, Japan)

Copper Recycling Technology from Alkaline Etchant

(K. Fujita: MELTECHS, Japan)

Development of Fuel Tank with Lead Free Aluminum Plated Steel

(S. Choji: Nissan Motor, Japan)

Biodegradable Plastics for LSI Sipping Materials

(T. Hashitani: Fujitsu, Japan)

New Environmentally Conscious Flame-retarding Plastics for Electronic Products

(M. Iji: NEC, Japan)

Lead Free Electro Deposition

(S. Yamamoto: Nissan Motor, Japan)

Solution for lift-off problem in Lead-free Soldering

(K. Suganuma: Osaka Univ., Japan)

 

Conference Organization

Conference Chair

Hiroyuki Yoshikawa (Science Council of Japan)

 

Organizing Committee Co-Chairs

Ryoichi Yamamoto (Univ. of Tokyo)

Fumihiko Kimura (Univ. of Tokyo)

Erin Craig (IEEE EHS Vice-Chair)

 

Technical Committee Chair

Tadatomo Suga (Univ. of Tokyo)

 

Organizing Committee:

Y. Ishikawa (Japan Techno-Economic Society),

H. Ishitani (Univ. of Tokyo),

H. Uchida (Tokai Univ.),

M. Okada (National Research Institute for Metals),

M. Kuriyagawa (National Institute for Resources and Environment),

T. Gunjima (Doshisha Univ.),

M. Sadakata (Univ. of Tokyo),

T. Takemoto (Osaka Univ.),

N. Tanaka (Hokkaido Univ.),

N. Nakajima (Univ. of Tokyo),

K. Nagata (Waseda Univ.),

T. Nakayama (Japan Environment Management Association for Industry),

I. Hashimoto (Kyoto Univ.),

Y. Baba (Univ. of Tokyo),

H. Hayashi (Manufacturing Science and Technology Center, Japan),

T. Fukushima (Japan Audit and Certification Organization),

T. Matsuo (Univ. of Tokyo),

T. Matsumura (Association for Electric Home Appliances),

S. Mori (Nagoya Univ.),

I. Yasui (Univ. of Tokyo),

Y. Ohira (SANYO DENKI CO., LTD.),

T. Kimura (NEC Corporation),

H. Koshibu (FUJI-XEROX CO., LTD.),

K. Koto (TOKYO GAS CO., LTD.),

H. Sakamaki (CANON INC.),

S. Susei (KAWASAKI HEAVY INDUSTRIES,LTD.),

T. Tani (RICOH COMPANY, LTD.),

T. Nakamura (MEIDENSHA CORPORATION),

H. Nemoto (MITSUI ENGINEERING & SHIPBUILDING CO., LTD.),

Y. Hirayama (EBARA CORPORATION),

K.Washio (MITA INDUSTRIAL CO., LTD.)

 

Technical Committee:

K. Aoyama (Univ. of Tokyo),

A. Inaba (National Institute for Resources and Environment, Japan),

H. Uchida (Tokai Univ.),

Y. Umeda (Univ. of Tokyo),

S. Owada (Waseda Univ.),

S. Kanai (Hokkaido Univ.),

T. Kiriyama (Univ. of Tokyo),

K. Suganuma (Osaka Univ.),

H. Suzuki (Univ. of Tokyo),

T. Tomiyama (Univ. of Tokyo),

M. Maeda (Univ. of Tokyo),

T. Murakami (Univ. of Tokyo),

K. Yagi (National Research Institute for Metals),

K. Asakura (Ishikawajima-Harima Heavy Industries Co., Ltd.),

T. Isogai (MEIDENSHA CORPORATION),

A. Ito (NISSAN MOTOR CO., LTD.),

A. Inoue (FUJI-XEROX CO., LTD.),

H. Iwasawa (MELTEX INC.),

H. Uesugi (KAWASAKI STEEL Corporation),

M. Uno (Hitachi, Ltd.),

Y. Ogawa (JAPAN EXCEL MANAGEMENT CONSULTING CO., LTD.),

M. Kato (MITA INDUSTRIAL CO., LTD.),

H. Kimura (EBARA CORPORATION),

T. Koga (FUJITSU LIMITED.),

K. Sakai (Sony Corporation),

T. Sato (RICOH COMPANY, LTD.),

S. Suda (Japan Environment Management Association for Industry),

R. Takeuchi (EBARA CORPORATION),

M. Nakajima (SANYO DENKI CO., LTD.),

J. Fujimoto (NEC Corporation),

F. Masuda (OPEN HOUSE),

Y. Minagawa (Fuji Photo Film Co., Ltd.),

Y. Yamada (CASIO COMPUTER Co.,LTD.),

H. Yamamoto (CANON INC.),

K. Yokoyama (IBM Japan, Ltd.),

R. Yoshikawa (KAWASAKI HEAVY INDUSTRIES, LTD.)

 

International Advisory Committee (tentative):

D. Allen (Univ. of Texas, USA)

L. Altings (Technical Univ. of Denmark, Denmark)

D. Bendz (IBM, USA)

G. Boothroyd (Boothroyd Dewhurst, Inc., USA)

H. Brezet (Technical Univ. of Delft, Netherlands)

B. Brox (IVF, Sweden)

P. Calkins (Xerox, USA)

K. Feldman (Univ. of Erlangen, Germany)

C. Handwerker (NIST, USA)

K. Ishii (Stanford Univ., USA)

J. Lee (UTRC, USA)

D. McGravis (HP, USA)

J. -G. Persson (KTH, Sweden)

H. Reichl (FhG-IZM, Germany)

G. Seliger (TU Berlin, Germany)

D. Spath (Univ. of Karlsruhe, Germany)

W. R. Stahel (Product-Life Institute, Switzerland)

A. Stevels (Philips, Netherlands)

L. Turbini (Georgia Tech., USA)

 

Cooperating Organizations (tentative)

Architectural Institute of Japan

Association for Electric Home Appliances

Clean Japan Center

Communications Industry Association of Japan

Electronic Industries Association of Japan

Engineering Advancement Association of Japan

Information Processing Society of Japan

Japan Association of Industries & Environment

Japan Automobile Manufacturers Association, Inc.

Japan Business Machine Makers Association

Japan Camera Industry Association

Japan Construction Equipment Manufacturers Association

Japan Electronic Industry Development Association

Japan Farm Machinery Manufacturer's Association

Japan Industrial Management Association

Japan Institute of Electronics Packaging

Japan Printed Circuit Association

Japan Refrigeration and Air Conditioning Industry Association

Japan Techno-Economics Society

Japan Vending Machine Manufacturers' Association

Japan Welding Society

Nagoya Industrial Science Research Institute

The Energy Conservation Center, Japan

The Institute of Electrical Engineers of Japan

The Institute of Electronics, Information and Communication Engineers

The Iron and Steel Institute of Japan

The Japan Electrical Manufacturings' Association

The Japan Hydraulics and Pneumatics Association

The Japan Institute of Metals

The Japan Research and Development Center for Metals

The Japan Society for Precision Engineering

The Japan Society of Applied Physics

The Japan Society of Industrial Machinery Manufacturers

The Japan Society of Mechanical Engineers

The Mining and Materials Processing Institute of Japan

The Surface Finishing Society of Japan

The United Nations University Institute of Advanced Studies

 

Access:

EcoDesign'99 Secretariat

Manufacturing Science and Technology Center (MSTC), Japan

 

Contact Point

Business Center for Academic Societies Japan

5-16-9, Honkomagome, Bunkyo-ku,

Tokyo 113-8622, Japan

Tel +81-3-5814-1440,  Fax +81-3-5814-1459

E-mail: van@bcasj.or.jp

(C)1999-2001  Sec, EcoDesign
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Last modified on 2001/02/09 00:37 JST